BGA vs. LGA in High Power Applications: A Comparative Guide
Anshul Pal Understanding the fundamental differences between BGA and LGA packages is essential for selecting the appropriate technology for high-power…
PCB Manufacturing
A Complete Guide to IC Package Technology
Over the years, IC packaging technology has undergone significant advancements. From the early days of simple dual in-line…
Is FR4 the Best Board Material for Your Design?
The history of FR4 dates back to the mid-20th century when advancements in material science led to the…
Understanding Castellated Mounting Holes: Design, Benefits, and Applications
In this blog post we will discuss the design, benefits, disadvantages and applications of castellated mounting holes, as…
7 Essential Things a PCB Design Engineer Should Know
Printed Circuit Boards (PCBs) are the backbone of modern electronic devices, providing the necessary infrastructure to connect and…
Understanding Radiation Loss: Its Impact on PCB Circuit Performance and Mitigation Strategies
In the realm of printed circuit board (PCB) design and manufacturing, radiation loss is a phenomenon that can…
What is PCB thieving?
Understanding PCB thieving is essential for anyone involved in the design and manufacturing of PCBs. By appreciating its…
Top 10 Tips for Successful Electronic Circuit Design
Electronic circuit design is a complex and intricate process that requires careful planning and execution. There are several…
Flip Chip – A detailed Guide
What is a Flip Chip? A flip chip is a type of semiconductor packaging technology that allows for…
PCB DFM vs PCB DFA: What’s the difference?
Two of these acronyms are PCB DFM and PCBA DFA. While they may sound similar, they actually refer…